Shenzhen Jinling Tongda Electronics Co., LTD

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non-silicon heat conduction potting adhesive
Specification: 30ml\55ml\100ml\300ml
Detail: Product features: 1. High temperature resistance: with excellent cold resistance and high temperature resistance, long-term can be used in high temperature up to 150 degrees, low temperature -40 degrees environment; 2. Excel...

thermal structural adhesive
Specification: 25ml*2\200ml*2\20l*2\200l*2
Detail: The GLPOLY thermal structure adhesive took three years to complete all the testing and verification. Thermal conductive structure adhesive XK-D30 has very hard core quality: 1. There is almost no rival in the four indexes of ...

thixotropic thermal conductive gel gasket
Specification: 30ml\55ml\100ml\300ml
Detail: Thixotropic type heat conduction gel gaskets XK - S20 coefficient of thermal conductivity is 2.0 W/mK, double agent packaging, thixotropic type low stress application, thixotropic type thermal conductive gel gaskets for advanc...

thermal conductive gel
Specification: 30*2ml¡¢55*2ml¡¢100*2ml¡¢300*2ml
Detail: Thermal conductive gel XK-G60 is a very recognizable product of GLPOLY with an ultra-high thermal conductivity of 6.5W/M.K. No curing, no vertical flow, Datang are using thermal conductivity gel. 5G-6G communication thermal c...

thermal conductivity structural adhesive
Specification: 30*2ml¡¢55*2ml¡¢100*2ml¡¢300*2ml
Detail: Two - component silicone - free thermal conductive structure adhesive series in Aibao Western group, including XK-D30H, XK-D30M, XK-D30L three curing Speed subdivision varieties need to be selected according to the user's pr...

high thermal conductivity gasket
Specification: 320*320mm
Detail: High thermal conductivity, high insulation, high voltage resistance, low oil permeability, high reliability, high compression and resilience, soft self-adhesive, easy construction


Showing 1 - 6 of 6, total 1 pages [First] [Previous] [Next] [Last]
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