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Shenzhen Jinling Tongda Electronics Co., LTD

Products >> thermal conductivity structural adhesive

thermal conductivity structural adhesive

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Description
Product Name: thermal conductivity structural adhesive
Supply Ability: 10000
Related proudcts thermal conductivity, thermal conductivity,
Specifications 30*2mlˇ˘55*2mlˇ˘100*2mlˇ˘300*2ml
Price Term: EXW
Port of loading:
Minimum Order
Unit Price:

Two - component silicone - free thermal conductive structure adhesive series in Aibao
Western group, including XK-D30H, XK-D30M, XK-D30L three curing
Speed subdivision varieties need to be selected according to the user's production characteristics
Curing speed Ht10 3h, Mt10 6h, Lt10 12h.
Among other things, the Lt10 can endow end users with enough on the production line
The reflux operation time of.
Among them, curing time T10 is shear bond strength reached (0.5 ~
1.0)***, indicating that the bonding interface can be demoulded offline; Cure time
T90 is the shear bond strength reaches 90% of the maximum, the bond interface can
In order to serve.
Xk-d30 has thermal insulation, super bonding and sealing functions. Can simplify engineering installation structure, reduce manufacturing cost,
Reduce the overall weight of the system, improve the installation efficiency of automatic production equipment, easy to use.

Contact Us
Company: Shenzhen Jinling Tongda Electronics Co., LTD
Contact: Ms. xuemei liao
Address: Room 616, 619, Huafeng Xin 'an Business Building, Baoan District, Shenzhen
Postcode:
Tel: 19520674448
Fax:
E-mail:         


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